REINFORCED STRUCTURE
The heat spreader of T-FORCE DARK Z/Za series is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive.

ENHANCED HEAT DISSIPATION
With superconductivity – thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the DARK Z/Za memory can offer the finest and smoothest gaming experience and an extreme performance without any lag.

SELECTED IC CHIPS STABLE AND DURABLE
Every IC chip made for TEAMGROUP’s T-FORCE DARK Z/Za DDR4 gaming memory is selected through a rigorous testing process. Every memory stick is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.

DARK Za DDR4 GAMING MEMORY
THE BEST SELECTION FOR AMD RYZEN 3000 SERIES
T-FORCE DARK Za DDR4 Gaming Memory is tailor-made for AMD Ryzen 3000 series processor and X570 motherboard. Tested under completed compatibility and stability, which can provide gamers a DDR4 gaming/overclocking memory with excellent quality and optimized performance.

Limited Lifetime Manufacturer Warranty